TIES-2021: National Conference on Technological Innovations in Engineering and Science IIMT College of Engineering, Greater Noida Knowledge Park-III, Greater Noida, India, April 16-17, 2021 |
Conference website | https://sites.google.com/view/ties2021 |
Submission link | https://easychair.org/conferences/?conf=ties2021 |
Abstract registration deadline | March 2, 2021 |
Submission deadline | March 5, 2021 |
To provide an opportunity to research scholars, delegates and students to interact and share their experience and knowledge in technology application, TIES-2021will provide an excellent national forum for sharing knowledge and results in recent innovations in Engineering, Science & Technology. The aim of the Conference is to provide a platform to the researchers, research scholars and practitioners from both academia as well as industry to meet and share cutting-edge development in the field.
Submission Guidelines
All papers must be original and not simultaneously submitted to another journal or conference. The following paper categories are welcome:
- Full papers describing lierature survey, technical implementation work.
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The templates of the manuscripts can be downloaded from the website of the conference. Plagiarism in manuscript should be less than 20%.
Papers will be submitted through EasyChair :
https://easychair.org/conferences/?conf=ties2021
List of Topics
The research papers are invited in the following thrust areas but not limited to:
- Machine learning and its applications, Artificial Intelligence techniques in Wireless Networks, Deep Learning and algorithms, AI and network security
- Data Science and Algorithms
- Advanced manufacturing techniques, Production and Manufacturing Engineering, Thermal and Fluid Engineering, Industrial Engineering
- Robotics and IoT applications
- Recent trends in ICT
- Nano Technology in Engineering and Science, Engineering Materials, Mathematical Modeling, Aerodynamics and its applications
- Computer Networks and Communications: MANET,WMN,WSN,SDN (Software Defined Networks) , VLSI &Quantum, Embedded systems, , Analog & Mixed Signal Design,
- Smart transportations, Structural designing
- Electric Hybrid Vehicles, Power systems
Committees
Program Committee
INTERNATIONAL ADVISORY COMMITTEE
- Dr. Hao Yi, Professor, College of Mechanical Engineering, Chongqing University, China
- Prof. Mohammed Atiquzzaman, Professor, School of Computer Science, University of Oklahoma, Norman, OK 73019, USA
- Prof. Dinh-Thuan Do, Professor, Asia University, Taichung 41354, Taiwan.
- Dr. Rajagopalan Krishnan, Post-doc Research Associate, University of the Free State, Bloemfontein, South Africa
- Dr. Kausalyah Venkatason, Senior Lecturer,University Teknologi MARA, Shah Alam, Malaysia
- Prof. San Murugesan, Adjunct Professor, Western Sydney University, Sydney, Australia
NATIONAL ADVISORY COMMITTEE
- Dr. Vishnu Narayan Mishra,Associate Professor , IGNT University, MP,India
- Dr. Lakshmi Narayan Mishra,Assistant Professor, VIT University, Tamil Nadu, India
- Dr. Narbada Prasad Gupta, Professor,, Lovely Professional University, Punjab, India
- Dr. S. Gomathi, Instructor & Teaching Consultant, UK International Qualifications Ltd.
- Prof. M. N. Hoda, Director, BVICAM, New Delhi-110063, India
- Prof. Deepak Garg, Director (Research), Bennett University, India
- Prof. Vinod Kumar, Professor, SRM University, UP, India
- Dr. Vishal Jain, Associate Professor, Sharda University, UP, India
- Prof. Rajeev Yadav, AIET, Kukas, Jaipur, Rajasthan, India
- Prof. Dibakar Das, Dean, University of Hyderabad, India
- Prof. Ajay Pratap, Professor, IIT-BHU, India
Organizing committee
Mr. Viswas Prof. Naveen Rathee Prof. Rama Krishna Prof. A. K. Sharma Prof. Jitendra
Ms Rajani Singh Ms Aruna Singh Mr. Uppendra Pratap Pandey Mr. Lakhan Singh Mr. Anand Kumar Yadav
Invited Speakers
- Prof. S.P. Khatkar
- Prof. Vinod Kumar
- Prof. Deepak Kumar
- Prof. Vinod Auja
Publication
TIES-2021 proceedings will be published in ...
All the accepted papers of the “National Conference on Technological Innovations in Engineering and Science (TIES-2021)” will be published in a proceeding book with ISBN “978-93-5445-453-0”.
Publication Opportunities:
Papers submitted and accepted by the review committee of the “National Conference on Technological Innovations in Engineering & Science” will be recommended to publish in SCOPUS indexed journals with extra cost.
Accepted and registered papers will be considered for publications in the following journals as per its publication policy:
- IOP Conference Series: Materials Science and Engineering(SCOPUS)*
- International Transaction Journal Of Engineering Management & Applied Sciences & Technologies(WoS-ESCI)
- Information Technology in Industry (WoS-ESCI Indexed Journal)
- Sambodhi Journal(UGC Care listed)
- Journal of the Maharaja Sayajirao (UGC Care listed)
*Proposal is under process
Venue
The conference will be held in Department of Information Technology, IIMT College of Engineering, Greater Noida, Uttar Pradesh.
Contact
All questions about submissions should be emailed to ties2021_gn@iimtindia.net
Sponsors
Conference is technically sponsored by CSI-Student Chapter, IIMT College of Engineering, Greater Noida, Uttar Pradesh