ISPD2018: International Symposium on Physical Design 2018 Monterey, CA, United States, March 25-28, 2018 |
Conference website | http://ispd.cc |
Submission link | https://easychair.org/conferences/?conf=ispd2018 |
Abstract registration deadline | October 3, 2017 |
Submission deadline | October 10, 2017 |
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CALL FOR PAPERS - ISPD 2018
ACM International Symposium on Physical Design
with a tribute to Professor Te C. Hu
http://www.ispd.cc
March 25-28, 2018
Monterey, California, USA
Sponsored by ACM SIGDA with Technical Co-sponsorship from IEEE CAS
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The International Symposium on Physical Design provides a premier forum to exchange ideas and promote
research on critical areas related to the physical design of VLSI systems. All aspects of physical design, including
its interactions with architecture, behavioral- and logic-level synthesis, and back-end performance analysis and
verification are within the scope of the symposium. Target domains include semi-custom and full-custom ICs,
regular fabrics, FPGAs, and systems-on-chip/systems-in-package. Following its twenty-six predecessors, the 2018
symposium will highlight key new directions and leading-edge theoretical and experimental contributions to the
field. The ACM Press will publish accepted papers in the Symposium proceedings. ISPD will recognize excellent
contributions through a Best Paper Award. Topics of interest include but are not limited to:
Floorplanning and interconnect planning Interactions with system and logic level design
Partitioning, placement and routing Analysis and management of power dissipation
Physical design for manufacturability and yield Management of design data and constraints
Synthesis optimizations within physical design New physical design methodologies
Estimation and modeling Physical design for FPGAs
Timing and crosstalk issues in physical design Circuit performance measurements in a PD context
Special structures for clocking and power networks Multithreaded/distributed algorithms for physical design
Physical design for emerging process technologies Hardware security related physical design
IMPORTANT DATES:
Title and abstract submission deadline October 3, 2017
Full manuscript submission deadline October 10, 2017
Acceptance notification November 18, 2017
Camera-ready paper due End of January, 2018
SUBMISSION OF PAPERS:
All papers must be submitted electronically via https://easychair.org/conferences/?conf=ispd2018. Details will
be posted on the website http://www.ispd.cc. Potential authors will be required to submit full-length, original,
unpublished papers (a maximum of 8 pages in ACM conference format) along with an abstract of at most 200
words and contact author information (name, mailing address, telephone/fax, e-mail). Previously published papers
or papers currently submitted for publication to other conferences/journals will not be considered. If one or more
related papers have been previously published or have been concurrently submitted elsewhere for publication, the
authors should clearly state the differences between these papers and the current submission. All submitted papers
will be under blind reviews, and thus they must not include name(s) or affiliation(s) of the author(s) anywhere in
the manuscripts. Failure to comply with these requirements will result in automatic rejection.
SYMPOSIUM ORGANIZATION:
General Chair Chris Chu (Iowa State Univeristy) [cnchu@iastate.edu]
Steering Committee Chair Mustafa Ozdal (Bilkent University) [mustafa.ozdal@cs.bilkent.edu.tr]
Technical Program Chair Ismail Bustany (Mentor, a Siemens Business) [ismail_bustany@mentor.com]
Publications Chair William Swartz (TimberWolf Systems & UT Dallas) [bill_swartz@utdallas.edu]
Publicity Chair Jens Lienig (Dresden University of Technology) [jens.lienig@tu-dresden.de]
Contest Chair Wen-Hao Liu (Cadence Design Systems Corporation) [whliu@cadence.com]