AC 2019: AUSTROCHIP 2019: 27th Austrian Workshop on Microelectronics University of Applied Sciences Technikum Wien; Hoechstaedtplatz 6, 1200 Wien, Austria Vienna, Austria, October 24, 2019 |
Conference website | https://embsys.technikum-wien.at/austrochip2019/ |
Submission link | https://easychair.org/conferences/?conf=austrochip2019 |
Submission deadline | August 23, 2019 |
Austrochip is an annual meeting and platform to present the latest activities in the field of microelectronics and integrated circuits in Austria and neighboring countries. The workshop is a forum for discussion and contact between academia and industry. Austrochip 2019 is the 27th edition organized by the Department of Electronics Engineering/Research Group Embedded Systems, FH Technikum Wien.
Submission Guidelines
- Submissions have to be anonymous - remove all authors and affiliations as papers will be blind-reviewed (authors and affiliations will be shown in the final paper only)
- Papers should have a minimum size of 4 pages any should not exceed 8 pages (including references and appendix)
- Submissions must be original and yet unpublished work, not being submitted in parallel to other conferences or journals
- Papers can be written in English or German but note that only submissions in English can be considered for publication at IEEE Xplore
List of Topics
- Analog, mixed-signal, and RF integrated circuits
- Digital circuits, filters, DSPs, asynchronous designs
- FPGA design and reconfigurable hardware
- Design methodology, system-level design, high-level synthesis, gigascale circuits, networks-on-chip
- Embedded systems, low-power design, fault-tolerant design, RF systems, security and safety aspects
- Verification and testing, signal integrity, device modelling, timing analysis, reliability simulation, EMC, ESD
- Emerging technologies, nano CMOS process technologies, sub-threshold circuits, sensors, organic and biomedical electronics
- Case studies and prototyping
Committees
Program Committee
- Mario Auer, Institute of Electronics, Graz University of Technology
- Alexander Bergmann, Institute of Electronic Sensor Systems, Graz University of Technology
- Bernd Deutschmann, Institute of Electronics, Graz University of Technology
- Dieter Draxelmayr, Infineon Technologies Austria
- Martin Horauer, Research Group Embedded Systems, University of Applied Sciences Technikum Wien
- Mario Huemer, Institute of Signal Processing, Johannes Kepler University Linz
- Michael Hutter, Rambus Technologies
- Nikolaus Kerö, Oregano Systems
- Hans-Peter Kreuter, Infineon Technologies Austria
- Manfred Ley, Carinthia University of Applied Sciences, Villach
- Christian Netzberger, FH Joanneum, University of Applied Sciences, Kapfenberg
- Burkhard Neurauter, eesy-ic
- Timm Ostermann, Institute for Integrated Circuits, Johannes Kepler University Linz
- Harald Pretl, Institute for Integrated Circuits, Johannes Kepler University Linz
- Peter Rössler, Research Group Embedded Systems, University of Applied Sciences Technikum Wien
- Gregor Schatzberger, ams AG
- Kerstin Schneider-Hornstein, Inst. of Electrodynamics, Microwave & Circuit Engineering, Vienna Univ. of Technology
- Peter Söser, Institute of Electronics, Graz University of Technology
- Andreas Steininger, Institute of Computer Engineering, Vienna University of Technology
- Johannes Sturm, Carinthia University of Applied Sciences, Villach
- Gunter Winkler, Institute of Electronics, Graz University of Technology
- Johannes Wolkerstorfer, xFace, Graz
- Horst Zimmermann, Inst. of Electrodynamics, Microwave & Circuit Engineering, Vienna University of Technology
Organizing committee
- Peter Rössler (General and Technical Program Chair), FH Technikum Wien
- Christian Fibich (Organization Chair), FH Technikum Wien
- Thomas Polzer (Publication Chair), FH Technikum Wien
- Patrick Schmitt (Publicity Chair), FH Technikum Wien
Publication
All submissions will be blind-reviewed by the technical program committee. Papers that are accepted by the program committee will be made available in electronic form at the conference. Conference proceedings will be created by the IEEE Computer Society Conference Publishing Services (IEEE CPS). All accepted papers that are written in English and that meet the IEEE requirements will be submitted to be published at IEEE Xplore as done for previous Austrochip conferences. Submission implies willingness of at least one of the authors to register and present the paper at the conference.
Venue
The conference will be held in Vienna, Austria, on Oct. 23, 2019.
Contact
All questions about submissions should be emailed to roessler@technikum-wien.at