VLSIDCS2022: 3rd International Conference on VLSI Device, Circuit and System IEEE MSIT SB Kolkata, India, January 19-20, 2022 |
Submission link | https://easychair.org/conferences/?conf=vlsidcs2022 |
IEEE VLSI DCS 2022 is organized by IEEE ED MSIT Student Branch Chapter. The technical program will be tailored to reflect the wide spectrum of topics and research interests shared by researchers in the fields. We invite you to submit your original contributions, not presented or published or submitted anywhere in full or in part, or not under consideration.
Submission Guidelines
Welcome to 3rd IEEE VLSI-DCS 2022, to be held in Meghnad Saha Institute of Technology (MSIT), Kolkata, India on January 19th-20th, 2022. The bi-annual VLSI-DCS conference is a premier international forum for researchers, developers and users to present and discuss the cutting edge ideas on topics related to the VLSI devices, circuits and Systems. The conference is organized by IEEE ED MSIT Student Branch Chapter. The technical program will be tailored to reflect the wide spectrum of topics and research interests shared by researchers in the fields. We invite you to submit your original contributions, not presented or published or submitted anywhere in full or in part, or not under consideration.
** All the accepted and presented papers will be sent to the IEEE for possible inclusion in the IEEEXplore
Topics of particular interest include, but are not limited to:
Track A: VLSI Devices
Device Modelling and Simulations,, Optoelectronic Devices and Displays, MEMS, Sensors and Imagers, Power Devices, Deeply Embedded Devices and technology, Characterization, Reliability and Yield, Compound Semiconductors and High Speed Devices, Process and Manufacturing Technology, Memory Devices, Emerging devices, Neuromorphic Devices and Device Concepts, Low Power Devices and Circuits, Advanced CMOS and Beyond CMOS Devices, Photovoltaic Devices, Emerging natural and nature-inspired materials, Advanced CMOS and Beyond CMOS Devices for application in Microsystems, Logic synthesis and finite automata, Circuit and Device Interactions, Biodegradable and Flexible electronic Devices, Electron Devices for “More than Moore”, Role of Electron Devices in Transforming Surface Transportation, synthesis and verification of integrated circuits and systems of any complexity
Track B: Nanotechnology:
Novel nano-materials and devices, Nanobiotechnology, Nanomaterials for energy conversion, Green nanotechnology, Nano Mechanics, Carbon Nanotubes emitters, Biological applications of nanoparticles, Energy applications of nanomaterials, Nano Fabrication and Metrology, Nano Heat Transfer and Energy Information Technology, Nano Sensors, Actuators and Systems Nanobionics, Nanofluidics and Bio Chips, Organic Electronics, Organic field-effect transistors (OFETs), organic electrochemical transistors (OECTs), proton transistors.
Track C: Analog/Digital/Mixed VLSI Circuits:
Analog and Mixed Signal Integrated Circuits, Amplifiers, Filters, Comparators, Oscillators, Multipliers, PLLs, RF ICs, Voltage/Current References, Sample-And-Hold Circuits, A/D and D/A Converters, High Speed IO Interface, Energy Harvesting, Power Management, Wireless Transceivers and RF/mm-Wave Circuits, Low Power Circuits and systems, Circuits in Sub-threshold and Near threshold regime, Digital Integrated Circuits, SOC, and NOC, Linear and Non-linear Circuits, Bio Chips; MEMS/NEMS circuitry, Standalone memory circuits: DRAM, FLASH, Quantum Modeling, chaos/neural/fuzzy-logic Circuits, novel I/O circuits for advancing data rates, improving power efficiency, and supporting extended voltage applications, clocking techniques including PLLs and CDRs components such as equalizers, high-speed ADC-RX/DAC-TX, silicon photonic and optical interface circuitry.
Track D: VLSI Systems : Embedded system: architecture, design, and software; System architectures: NoC, 3D, multi-core, and reconfigurable; Memory System; FPGA designs, FPGA based systems; CAD: synthesis and analysis, Prototyping, verification, modeling, and simulation; imagers, displays, sensors and biomedical and healthcare applications; IoT including ultra-low power, energy harvest, wearable,sensors, display, and communication devices Big Data, Machine learning Algorithm; Wireline and Optical Communications Circuits and Systems for electrical and optical communications including serial links for intra-chip and chip-to-chip interconnections,high-speed memory and graphics interfaces, backplanes, long-haul, and power line communications; flexible, printed, large-area and organic electronics. system in package, 2.5D, 3D and monolithic 3DIC, multi-die heterogeneous integration, silicon photonic interconnects and packaging, advanced assembly and bonding, embedded cooling technologies, Efficient electrical system, Reconfigurable computing, Cluster Computation, High Performance Distributed Computing (HPDC), parallel and/or distributed computing techniques, parallel processing, distributed computing systems and computer networks.
Track E: VLSI Algorithm, Design & Testing :
Analog/Mixed-Signal/RF Test, ATPG & Compression, Embedded System & Board Test, Embedded Test Methods Emerging Technologies Test, FPGA Test, Silicon Debug, Automotive Test & Safety, Built-In Self-Test (BIST) Defect & Current Based Test, Defect/Fault Tolerance, Delay & Performance Test, Design for Testability (DFT) Design Verification /Validation, Fault Modeling and Simulation, Hardware Security, Low-Power IC test , Microsystems / MEMS /Sensors Test, Memory Test and Repair, On-Line Test & Error correction, Power / Thermal Issues in Test, System-on-Chip (SOC) Test, Test Standards, Test Economics, Test of Biomedical Devices, Test of High-Speed I/O, Test Quality and Reliability, Test Resource Partitioning, Transients and Soft Errors 2.5D, 3D and SiP Test.
Special Theme: Circuits and Systems for Artificial Intelligence / Machine Learning computing
Paper Submission Guidelines and Proceedings
1.Paper Submission Guidelines and Proceedings• Paper length must be maximum five pages of A4 size paper including figures and references. Its content must be original and unpublished• Manuscript must be prepared to conform IEEE Conference format, e.g. font type, size, column, etc. Accepted paper/s must be registered and presented at the conference.• If an author has got more than one accepted papers, each paper has also to be registered. Papers (pdf ) are to be submitted via Easy Chair Conference System.
Paper Submission link:
https://easychair.org/conferences/?conf=vlsidcs2022.
Contact
All questions about submissions should be emailed to ...
Dr. Manash ChandaGeneral Chair, 2022 VLSI DCS
Advanced VLSI Design Lab,Dept. of ECEMeghnad Saha Institute of Technology,Nazirabad, Uchchepota, Kolkata-700150, West Bengal, India
mail id: ieee.vlsidcs@gmail.com ( for conference related query)
manash@msit.edu.in ( for urgent query)
contact no.: +91 9830059765