CHILECON 2023: 2023 IEEE CHILEAN Conference on Electrical, Electronics Engineering, Information and Communication Technologies Club de la Unión Valdivia, Chile, December 5-7, 2023 |
Conference website | https://site.ieee.org/chilesur/ieee-chilecon-2023/ |
Submission link | https://easychair.org/conferences/?conf=chilecon2023 |
Conference program | https://easychair.org/smart-program/CHILECON2023/ |
Submission deadline | September 10, 2023 |
Author notification | November 2, 2023 |
Camera ready papers | November 20, 2023 |
IEEE ChileCon 2023
2023 IEEE CHILEAN CONFERENCE ON ELECTRICAL, ELECTRONIC ENGINEERING, INFORMATICS AND COMMUNICATIONS TECHNOLOGY
Dec 5th - 7th, 2023
Valdivia, Región de los Ríos, Chile
Organized by the IEEE Chile Sur Section and IEEE Chilean chapters
The IEEE CHILECON Conferences are technical activities organized by the IEEE Chilean sections and chapters that are held in Chile every two years. The conference aims to promote the advancement of theory, development, and applications of Electrical, Electronics, Informatics and Industrial Engineering, the continuing education of its members and students and the cooperation and collaboration among professionals, academics and students. Previous versions of this conference have received more than 200 submissions from Chile, Latin America and abroad, which are carefully reviewed by an international program committee. Accepted papers presented at the conference are published in IEEE Xplore and submitted to Scopus for indexing. Please continue reading below if you want to submit a technical contribution to CHILECON 2023. For general information on the conference, such as registration and venue, please see https://site.ieee.org/chilesur/ieee-chilecon-2023/.
Submission Guidelines
Submit your paper by September 10th, 2023, via Easychair, according to the following rules:
- All papers must be original and not sent simultaneously to another journal or conference.
- All papers must be electronically submitted through the EasyChair system* using the following link: https://easychair.org/conferences/?conf=chilecon2023.
- The paper must be written using the official IEEE Microsoft Word or LaTeX templates for Conference proceedings (US letter size).
- Papers must be no longer than six pages, including all figures and references.
- Each paper has to have Title, Abstract and Keywords in English. The rest of the paper can be written in Spanish, Portuguese, or English. Please see the IEEE author center for more information on structuring your paper.
- Each paper will undergo a strict peer review and plagiarism verification process. Authors are expected to follow IEEE ethics guidelines. The Program Committee will determine if the work is accepted or rejected. Their decision is final.
- For accepted papers to be included in the Proceedings of IEEE CHILECON 2023, the paper has to be presented during the conference and at least one of its authors has to purchase a full registration. The full registration fee includes only one paper. Additional papers are paid separately. Please see the main conference website for details on the registration process. The papers included in the Proceedings of IEEE CHILECON 2023 will be made available via the IEEE Xplore Digital Library and submitted to the Scopus database for indexing.
*You will need an EasyChair account to submit your paper. If you don’t have one yet, please see: https://easychair.org/account/signup
List of Topics
Full papers describing original contributions in any of the following topics will be considered for revision:
- Aerospace
- Computational Intelligence and AI
- Astro-engineering
- Biomedical Engineering
- Education in Engineering
- Geoscience and Remote Sensing
- Communication Systems
- Computer Networks
- Computer Systems
- Computer Vision
- Control Theory and Applications
- Creative and Artistic Technologies
- Digital Agriculture
- Ecological and Environmental Technology
- Electromobility
- Energy Efficiency
- Industrial Applications
- Process Control
- Image processing
- Industrial Automation
- Industrial Communications
- Informatics and Software Engineering
- Information and Communication Technologies in Education
- Information Technologies
- Micro & Nanosystems
- Oceanic Engineering
- Power Energy Systems
- Power Electronics
- Robotics and Automation
- Sensors and Sensor Networks
- Signal Processing
- Social Implications of Technology
Important Dates
- Submission deadline: September, 10th
- Author notification: October, 27th
- Camera-ready papers: November, 15th
- Conference: December, 5th-7th
Committees
Program Committee
- Pablo Acuña, Universidad de Talca
- Sandra Cano, Pontificia Universidad Católica de Valparaiso
- Carlos Cárdenas, Universidad de Magallanes
- Hector Chávez, Universidad de Santiago de Chile
- José Delpiano, Universidad de los Andes
- Julio Fenner, Universidad de la Frontera
- Fernando Fuentes, Universtidad de Talca
- Carlos Fuhrhop B., Universidad Austral de Chile
- Daniel Guerra, Universidad Austral de Chile
- Nestor González V., Universidad Mayor
- Victor Grimblatt, Synopys
- Luis Gutierrez, Universidad Adolfo Ibañez
- Miguel Gutierrez, Universidad Mayor
- Pablo Huijse, Universidad Austral de Chile
- Daniel Lühr, Universidad Austral de Chile
- Sebastián Maldonado, Universidad de Chile
- Oswaldo Menéndez, Universidad Andrés Bello
- Nicolas Muller P., Universidad Austral de Chile
- Carlos Muñoz, Universidad de la Frontera
- Cristian Olivares, Universidad Austral de Chile
- Iván Ramírez, Universidad Mayor
- Lorenzo Reyes C., Universidad Austral de Chile
- Antonio Rienzo, Universidad de Valparaiso
- Eliana Scheihing, Universidad Austral de Chile
- Miguel Solís, Universidad Andrés Bello
- Luis Veas, Universidad Austral de Chile
- Jorge Vergara, Universidad Tecnológica Metropolitana
- Thamara Villegas, Universidad Mayor
Organizing Committee
- General Chair: Daniel Lühr
- General Co-chair: Gastón Lefranc
- Financial Chair: Isabel Miranda
- Communication: José Mardones F.
- Outreach: José Saavedra
- Advising committee: Karina Barbosa, Gastón Lefranc and Mario Fernández
Publication
CHILECON 2023 proceedings will be published in the IEEE XPLORE Digital Library and submitted to the Scopus database for indexing.
Venue
The conference will be held in Club de la Unión, Valdivia, Región de los Ríos, Chile. This is a hybrid event. You can participate in person or online.
Contact
All questions about submissions should be emailed to pablo.huijse@uach.cl