ICSMA 2018: 2018 International Conference on Smart Materials Analysis National University of Singapore Singapore, Singapore, January 26-28, 2018 |
Conference website | http://icsma.org/ |
Submission link | https://easychair.org/conferences/?conf=icsma2018 |
Submission deadline | November 30, 2017 |
2018 International Conference on Smart Materials Applications (ICSMA 2018) will take place in Singapore during January 26-28, 2018. The conference program covered invited, oral, and poster presentations from scientists working in similar areas to establish platforms for collaborative research projects in this field. This conference will bring together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations and to spark new ideas, with the aim of developing new projects and exploiting new technology in this field.
Committees
Program Committee
- Person 1 Prof. Alfonso Maffezzoli, University of Salento,Italy
- Person 2 Assoc. Prof. GUPTA Manoj, National University of Singapore, Singapore
- Person 3 Dr. Xuelin Lei, East China University of Science and Technology, China
Invited Speakers
- Speaker 1 Professor LU Li, National University of Singapore, Singapore
- Speaker 2 Prof. Hao Gong, National University of Singapore, Singapore
- Speaker 3 Prof. Dr. Xiaohong ZHU, Sichuan University, China
- Speaker 4 Prof. Alfonso Maffezzoli, University of Salento, Italy
- Speaker 5 Assoc. Prof. GUPTA Manoj, National University of Singapore, Singapore
Publication
Submissions will be peer reviewed by 2-3 reviewers. The registered and presented papers will be published into
IOP Conference Series: Materials Science and Engineering (Online ISSN: 1757-899X; Print ISSN: 1757-8981),
which is indexed by Ei Compendex, Scopus, Thomson Reuters (WoS), Inspec,et al.
Contact
Conference Secretary of ICSMA 2018: Ms. Chelsea Wang
Via Email: icsma@saise.org
Tel: +1-302-444-8432 (USA)/ +86-18062000004 (China)
(AM 9:30-PM 06:00, Monday to Friday)