ICPIE 2018: 2018 the International Conference on Product and Industrial Engineering Chengdu, China, October 27-29, 2018 |
Conference website | http://icpie.org/ |
Submission link | https://easychair.org/conferences/?conf=icpie2018 |
Submission deadline | September 5, 2018 |
2018 the International Conference on Product and Industrial Engineering (ICPIE 2018)will be held in Chengdu, China during October 27-29, 2018, with support of some univeristies.
Submission Guidelines
1.Full Paper (Presentation and Publication)
Accepted full paper will be invited to give the oral presentation at the conference and be publsihed in the conference proceeding.
Please log in the Electronic Submission System; ( .pdf only) to submit your full paper.
If you have queries about submission, please send mail via: icpie@zhconf.ac.cn
2.Abstract (Presentation only)
Accepted abstract will be invited to give the oral presentation at the conference, the presentation will not be published.
Please log in the Electronic Submission System; ( .pdf only) to submit your abstract.
1. Each paper should be no less than full 4 pages and has the maximum length of 5 pages normally, and additional pages will be charged. (一篇文章投稿至少不能低于4页)
2. The full papers can be written in English and please download the template for the full paper here.(英语为大会唯一官方语言,大会仅接受英文投稿,会议现场报告也需为英文。)
3. The full paper submission is required for publication. (若文章有出版需求,大会仅接受全文投稿。如果不需出版,仅参会做报告,可接受摘要投稿.)
4. The version of your submission must be in the requested format. The authors are suggested to use the ICPIE2018 template. (投稿论文需满足会议格式要请下载论文格式模板)
List of Topics
- Industrial design
Industrial Tribology
Intelligent controllers
Internal Combustion Engines
Machine Design
Machinery and Machine Design
Machinery Dynamics
Manufacturing engineering
Manufacturing processes and technology
Manufacturing system and simulation
Mechanical Engineering
Mechanical Power Engineering
Micro-Machining
Nano fabrication and precision engineering
Optimization of Systems
Rapid Prototyping
Refrigeration and air conditioning
Ship Designing and Building
Solid and Fracture Mechanics
Solid Mechanics
Spacecraft/Launch Vehicle Systems and Technologies
Surface mount and packaging technology
Tribology and Reverse Engineering
Committees
Conference Chairs
C. W. Lim, City University of Hong Kong, Hong Kong
Cees de Bont, Hong Kong Polytechnic University, Hong Kong
Program Chairs
Prof. Thomas Kang, Seoul National University, South Korea
Prof. Kyung-Jae Shin, Kyungpook National University, South Korea
Technical Committees
Renjie JI, China University of Petroleum, China
Tsai Sang-Bing, Zhongshan Institute, China and University of Electronic Science and Technology of China, China
Abdullah Abbas Kendoush, Augusta Technical College, USA
Yiyo Kuo, Ming Chi University of Technology,Taiwan
Sanda Renko, University of Zagreb, Croatia
Grigorios L. Kyriakopoulos, University of Athens (NTUA), Greece
Samir Mekid, King Fahd University Petroleum & Minerals, Saudi Arabia
Abbas Amini, Western Sydney University, Australia
Invited Speakers
- Speaker 1 Prof. C. W. Lim, City University of Hong Kong, Hong Kong
- Speaker 2 Prof. Cees de Bont, Hong Kong Polytechnic University, Hong Kong
- Speaker 3 Prof. Thomas Kang, Seoul National University, South Korea
- Speaker 4 Prof. Kyung-Jae Shin, Kyungpook National University, South Korea
Publication
After a careful reviewing process, all accepted papers after proper registration and presentation, will be published in the Conference Proceedings, and sent to be submitted by Ei Compendex and Scopus.
Contact
If you have any enquires, please feel free to contact the conference secretary Ms. Rachel Cao, via email:icpie@zhconf.ac.cn
TEL: 86-13880104217 Working Time: Monday to Friday 10 am—5:30 pm