ICICM 2019: The 4th International Conference on Integrated Circuits and Microsystems Beijing, China, October 25-27, 2019 |
Conference website | http://icicm.net/ |
Submission link | https://easychair.org/conferences/?conf=icicm20190 |
Submission deadline | August 30, 2019 |
The previous 3 editions ICICM were sponsored by IEEE and it has been successfully held in Chengdu on November 23-25, 2016 in Nanjing on November 8-11, 2017, and in Shanghai on November 24-26, 2018. The 4th International Conference on Integrated Circuits and Microsystems (ICICM 2019) will be held on October 25-27, 2019 in Beijing, China with the support from University of Electronic Science and Technology of China and Southeast University, China.
Submission Guidelines
1. Please log in the EasyChair Submission System and upload your paper; You need an easychair account, if you don't have, you can register first.
2. Should you have any questions, please feel free to contact us at icicm@young.ac.cn
List of Topics
Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technology
Reliability
Displays, sensors and MEMS
Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)
Committees
Advisory Chair
Prof. Ljiljana Trajkovic, IEEE Fellow, Simon Fraser University, Canada
Conference Chairs
Prof. Zhigong Wang, Southeast University, China
Prof. Li Qiang, University of Electronic Science and Technology of China, China
Prof. Gene Eu Jan, National Taipei University, Taiwan
Program Chairs
Prof. Fei Yuan, Ryerson University, Canada
Prof. Zou Zhuo, Fudan University, China
Prof. Liu Dake, Beijing Institute of Technology, China | Linköping University, Sweden
Assoc. Prof. Keping Wang, Southeast University, China
Steering Committee Chairs
Prof. Huang Le Tian, University of Electronic Science and Technology of China, China
Prof. Dai Yong-Sheng, Nanjing University of Science & Technology, China
Prof. Sheng-Lyang Jang, National Taiwan University of Science and Technology, Taiwan
Invited Speakers
Prof. Ljiljana Trajkovic, IEEE Fellow
Simon Fraser University, Canada
Prof. Fei Yuan
Ryerson University, Canada
Prof. Zou Zhuo
Fudan University, China
Publication
All accepted papers after proper presentation and registration will be collected in the conference proceedings, which will be submitted and reviewed in the IEEE Xplore, Ei Compendex, Scopus, and CPCI (Web of Science) after the conference.
Contact
Ms Sissi Chan
Email: icicm@young.ac.cn
Tel: +86-28-87777577