ICFM 2019: 2019 International Conference on Functional Materials Tohoku, Japan, September 4-6, 2019 |
Conference website | http://icfm.net/ |
Submission link | https://easychair.org/conferences/?conf=icfm2019 |
Submission deadline | July 15, 2019 |
The conference aims to provide a forum for many of the leading researchers, scientists and engineers from across the field of Functional Materials. We welcome you to join us this year for a program that includes keynote speakers, oral presentations and poster sessions. Join others in the scientific community by presenting your research through submitting papers for evaluation. ICFM 2019 promises to be a key opportunity to create new business relationships, learn about cutting edge research and find global partners for future projects.
Submission Guidelines
Full Paper Submission
Submissions are to be made via http://www.easychair.org/conferences/?conf=icfm2019, you will be requested to upload the file of your paper (in PDF format only). Or submit via conference e-mailbox: icfm@academic.net. Submissions not meeting these guidelines risk rejection without consideration of their merits.
Abstract Submission
Abstracts are welcomed to be submitted to ICFM conference. Accepted abstracts will be invited to make an oral or poster presentation during the conference in Japan.
List of Topics
Non Ferrous Metal Material
High Strength Alloys
Iron and Steel
Materials Processing and Handling
Composites
Micro/Nano Materials
Ceramic
Optical, Electronic, Magnetic Materials
Carbon Based Materials Metallurgical Science
Metallurgical Fundamentals and Techniques
New Functional Materials
Building Materials
New Energy Materials
Environmental Friendly Materials
Earthquake Materials and Design
Biomaterials
Smart and Intelligent Materials
Intelligent Materials Systems
Polymeric Materials
Thin Films
Mechanical Behavior and Fracture
Tool Testing and Evaluation of Materials
Processing Technology for Functional Materials
Committees
Conference Chairs
Shu Yin, Tohoku University, Japan
LU Li, National University of Singapore, Singapore
Program Chairs
Yamato Hayashi, Tohoku University, Japan
Takahiro Yamada, Tohoku University, Japan
Jiangfeng Ni, Soochow University, China
Publication Chairs
Yusuke Asakura, Tohoku University, Japan
Xuelin Lei, East China University of Science and Technology, China
Technical Committee
Tian Wu, Hubei University of Education, China
Chao-Ming Lin, National Chiayi University, Taiwan
Mohamed Abdel Kader Ismail El-Gelany, Curtin University Sarawak Malaysia, Malaysia
Razali Ismail, Universiti Teknologi Malaysia, Malaysia
Yong Zhao, Nazarbayev University, Kazakhstan
Harith Ahmad, University of Malaya, Malaysia
Mohd Hasmizam Razali, Universiti Malaysia Terengganu, Malaysia
Chi-wai Kan, The Hong Kong Polytechnic University
Eriki Ananda. K, VEMU Institute of Technology, India
Fazlena Hamzah, University Technology MARA, Malaysia
TeoMing Ting, Malaysian Nuclear Agency (Nuclear Malaysia) Bangi, Malaysia
Kim Yeow TSHAI, University of Nottingham Malaysia Campus, Malaysia
Hong Zhou, Waikato Institute of Technology, New Zealand
Ping Xiang, City University of Hong Kong, Hong Kong
Saiful Izwan Abd Razak, Universiti Teknologi Malaysia, Malaysia
Nongluck Houngkamhang, King Mongkut Institute of Technology Ladkrabang, Thailand
Invited Speakers
- Prof. LU Li,National University of Singapore, Singapore
- Prof. Shu Yin,Tohoku University, Japan
- Prof. Jinshu Wang,Beijing University of Technology, China
- Prof. Jiangfeng Ni,Soochow University, China
Publication
Key Engineering Materials (ISSN: 1662-9795) published by TTP. It will be sent for major indexing, such as EI Compendex and SCOPUS
Contact
Ms. Frannie Lee