ICCSD 2019: The 3rd International Conference on Circuits, Systems and Devices Tibet Hotel Chengdu Chengdu, China, August 23-25, 2019 |
Conference website | http://iccds.org/ |
Submission link | https://easychair.org/conferences/?conf=iccsd2019 |
Submission deadline | July 5, 2019 |
The age of 5G communication is approaching. Sponsored by IEEE, 2019 IEEE The 3rd International Conference on Circuits, Systems and Devices(IEEE ICCSD 2019) will take place at Chengdu, China, August 23-25, 2019. ICCSD is supported by Sichuan Institute of Electronics, UESTC, Southeast University, China and University of Detroit Mercy, USA, it will provide a premier interdisciplinary platform for researchers, practitioners and educators to present and discuss the most recent innovations, trends, and concerns as well as practical challenges encountered and solutions adopted in the fields of Circuits, Devices and Systems.
Submission Guidelines
Full and short paper
Papers should not exceed 10 pages (including all text, figures, references and appendices) for full papers or 6 pages for short experience and position papers. Each submitted paper must conform to the publication format. Papers will be reviewed by at least two members from the program committee. Accepted papers will be published in the conference proceedings.
Abstracts
If you do not plan to submit a full paper for the ICCSD proceedings, submitting an abstract for presentation only is welcome. These abstracts will not be included in the proceedings of ICCSD.
List of Topics
- Circuits, devices and systems
- Smart grid and circuit
- Signal and multimedia processing
- Computers, software and applications
- Ocean engineering and marine technology
- Biomedical electronics and bioinformatics
- Communication engineering
- Electronics and electrical engineering
- Computer science applications
- Nano electro mechanical System
- Photonics and optoelectronics
- Networking, communication and multimedia
- Information engineering
- Wireless/Mobile communication and computing
- Software specification and software assurance
- Analysis of power quality and system stability
- Assembly and packaging
- Analog circuits and digital circuits
- Antenna and propagation
- Electric energy processing
- Electromagnetic and photonics
- Electro-optical phenomena of semiconductors
- Power electronics and energy systems
- Signal processing
- Techniques of laser and applications Of electro-optics
- Simulation of propagation
- Battery management system
- Circuits and electronics
- Computer relaying integrated optics and electro-optics devices
- Microwave theory and techniques
- Microwave and millimeter
- Modulation, coding, and channel analysis
- Power electronics
- Remote control and techniques of GPS
- Robotics and atomization engineering
- Signal integrity design for high-speed digital systems
- Solar power generation
- Wind power generation
Committees
Advisory Chair
- Xiaoqing Wen, Kyushu Institute of Technology, Japan, IEEE Fellow
Conference Chair
- Zhi-Gong Wang, Southeast University, China
Program Chairs
- Letian Huang, University of Electronic Science and Technology of China, China
- Li Wenyuan, Southeast University, China
- Meng Zhang, Southeast University, China
Technical Committee
- Abdel-Aziz Farrag, Dalhousie University, Canada
- Chung-An Shen, Taiwan University of Science and Technology, Taiwan
- Zhang Weifeng, Shenzhen Institute of Information Technology, China
- Jinghong Chen, University of Houston, USA
- Sheila Abaya, University of East-Caloocan, Philippines
- Mohd Faizul Mohd Sabri, University of Malaya, Malaysia
- Jens Kohler, University of Applied Sciences, Germany
- Orla Nic Suibhne, University College Dublin, Ireland
- Thi Hong Tran, Nara Institute of Science and Technology, Japan
- Mohd Faiz Bin Mohd Salleh, University of Malaya, Malaysia
- Sharifah Fatmadiana, University of Malaya, Malaysia
- Bo Jiang, Omni Vision Technologies, USA
- Affaq Qamar, Abasyn University Peshawar, Pakistan
Invited Speakers
- Juin J. Liou IEEE Fellow | Chair Professor and Director,Zhengzhou University, China
- Prof. Jong-Ho Lee, IEEE Fellow,Seoul National University, Korea
- Prof. Shiwei Feng,Beijing University of Technology, China
Publication
- Accepted and registered papers will be published by IEEE Conference Publication. and indexed by EI Compendex, Scopus etc.
Contact
Jennifer Y. Luo
Email: iccsd@academic.net
Tel: +86 (0)28 8652-8629 | Call us: Monday-Friday | 10:00-18:00