HPCMALL 2023: 2nd International Workshop on Malleability Techniques Applications in High-Performance Computing ISC 2023 Hamburg, Germany, May 21-25, 2023 |
Conference website | https://www.admire-eurohpc.eu/events/hpcmall/ |
Submission link | https://easychair.org/conferences/?conf=hpcmall2023 |
Abstract registration deadline | March 7, 2023 |
Submission deadline | March 15, 2023 |
Preliminary version of papers: March 7th 2023. Extended to March 15th 2023.
Workshop Chairs
Prof. Jesus Carretero, University Carlos III of Madrid, Spain.
Prof. Martin Schulz, Technical University of Munich, Germany.
Dr. Estela Suarez, Juelich Supercomputing Centre, Forschungszentrum Juelich GmbH, Germany.
Workshop Program Committee (tentative)
Fabio Affinito. Cineca. Italy
Alexander Antonov. Moscow State University, Russia
Jean-Baptiste Besnard. ParaTools SAS. France
Andre Brinkmann. Johannes Gutenberg-Universität Mainz. Germany
Iacopo Colonnelli, University of Totino. Italy.
Norbert Eicker. JSC and Univ. Wuppertal. Germany.
Hamid Mohammadi Fard. Technical University of Darmstadt. Germany
Javier Garcia Blas. Carlos III University. Spain
Michael Gerndt. Technical University of Munich. Germany.
Balazs Gerofi. RIKEN. Japan.
Emmanuel Jeannot. INRIA. France.
Michael Klemm. AMD. Germany.
Masaki Kondo. Keio University. Japan.
Erwin Laure. MPCDF. Germany.
Stefano Markidis. KTH. Sweden.
Thomas Moschny. PARTEC. Germany.
Ramon Nou. Universitat Politècnica de Catalunya. Spain
Ariel Oleksiak. Poznan Supercomputing and Networking Center. Poland.
David E. Singh. Universidad Carlos III de Madrid. Spain
Martin Schreiber University of Grenoble-Alpes. France
Sameer Shende. ParaTools SAS. USA.
Miwako Tsuji. RIKEN AICS. Japan.
Marc André Vef. Johannes Gutenberg-Universität Mainz. Germany.
Carlos A. Varela. Rensselaer Polytechnic Institute. USA.
Vladimir Voevodin. Moscow State University. Russia.
Mohamed Wahib. AIST/TokyoTech. OIL Japan.
Josef Weidendorfer. Technical University of Munich. Germany
Roman Wyrzykowski. Czestochowa University of Technology. Poland.
Description of the workshop
The current static usage model of HPC systems is becoming increasingly inefficient. This is driven by the continuously growing complexity and heterogeneity of system architectures, in combination with the increased usage of coupled applications, the need for strong scaling with extreme scale parallelism, and the increasing reliance on complex and dynamic workflows.
As a consequence, we see a rise in research on malleable systems, middleware software and applications, which can adjust resources usage dynamically in order to extract a maximum of efficiency. By providing an intelligent global coordination of resources usage, through runtime scheduling of computation, network usage and I/O across all components of the system architecture, malleable HPC systems can maximize the exploitation of their resources, while at the same time minimizing the makespan of applications in many, if not most, cases.
Of particular concern is the emerging class of data-intensive applications and their interaction with classic simulation workloads, driven by the growing need to process extremely large data sets. However, uncoordinated file access in combination with limited bandwidth make the I/O system a serious bottleneck. Emerging multi-tier storage hierarchies come with the potential to remove this barrier, but maximizing performance still requires careful control to avoid congestion. Malleability allows systems to dynamically adjust the computation and storage needs of applications, on the one side, and the global system on the other.
Such malleable systems, however, face a series of fundamental research challenges, including: who initiates changes in resource availability or usage? How is it communicated? How to compute the optimal usage? How can applications cope with dynamically changing resources? What should malleable programming models and abstractions look like? How to design resource management frameworks for malleable systems? Which resources benefit from malleability and which (if any) should still be managed statically?
In order to address these challenges, the HPCMALL 2023 workshop will bring together researchers from diverse areas of HPC that are impacted or actively pursuing malleability concepts, from application developers to system architects, from programming model to system software researchers. The workshop will provide a lively discussion forum for researchers working in HPC and pursuing the concepts of and around malleability.
Topics:
We are looking for original high-quality research and position papers on applications, services, and system software for malleable high-performance computing systems. Topics of interest include, but are not limited to:
- System and system architecture considerations in designing malleable architectures.
- Emerging software designs to achieve malleability in high-performance computing.
- High-level parallel programming models and programmability techniques to improve applications malleability.
- Run-time techniques to provide malleable execution models for computation, communication and I/O.
- Resource management frameworks and interfaces supporting malleable scheduling, resource allocations and application execution.
- Computing and I/O scheduling algorithms providing and/or exploiting static or dynamic malleability.
- Use of AI and ML techniques to steer malleability in systems and applications.
- Ad-hoc storage systems and I/O scheduling techniques helping I/O malleability.
- Support for malleable execution of applications in performance, debugging and correctness tools.
- Energy efficiency and malleability (applications, over-provisioned systems wrt. power/energy, storage systems, etc.).
- Experiences and use cases applying malleability to HPC applications.
Tentative Dates
- Abstract submission: March 7st 2023 (EXTENDED)
- Preliminary version of papers: March 15th 2023. (EXTENDED)
- Notification: April 6th, 2023
- Final version of the paper: April 21st, 2023
Publication
Papers will be published together with ISC proceedings.
- We will allow both regular full page research papers (maximum 12 pages, including figures and references), as well as 6-8 page short or position papers, in order to cover both more mature approaches in the area as well as hot and novel concepts in their early stages.
A Journal Special Issue will be published in a reference journal. The special issue will have an open CFP, but extended versions of the best papers accepted at HPCMALL 2023 will be invited for publication. All papers will undergo the usual peer-review process of the journal.
Submission Guidelines
Paper submissions are required to be formatted using LNCS style (see Springer’s website):
- Single-column format
- Maximum 12 pages (including figures and references)
- Use Springer’s LaTeX document class or Word template (see Springer’s Proceedings Guidelines)
- Papers must be suitable for double-blind review (see ISC High Performance Double-Blind Review Guidelines)
- The PC reserves the right to reject incorrectly formatted papers
- Papers cannot have been previously published or simultaneously under review