The Euromicro Conference on Digital System Design (DSD) addresses all aspects of (embedded, pervasive and high-performance) digital and mixed HW/SW system development and covers the entire design process from specification to microarchitectures, digital circuits and VLSI implementations. It is a forum for researchers and engineers from academia and industry working on advanced research, development and applications. It focuses on the current and future challenges of: advanced embedded, high-performance and cyber-physical applications; system and processor architectures for embedded and high performance HW/SW systems; design methodology and design automation for all design levels of embedded, high performance and cyber-physical systems; modern implementation technologies ranging from full-custom circuits in nanometer technology nodes to FPGAs and MPSoC infrastructures. Authors are cordially invited to submit their work on (but not limited to) the topics of the main track of the conference. In addition, contributions to various special sessions (with dedicated coordinators and sub-program committees) on specific topics of special interest are welcome. All papers will be reviewed according to common guidelines, quality requirements and acceptance thresholds.

Main Topics

• Artificial intelligence from edge to cloud: architectures, methods, tools and applications
• Design and synthesis of systems, hardware and embedded software – specification, modelling, analysis, validation and testing
• Design automation at system, processor, register-transfer, logic and physical levels
• Formal methods in system and hardware design
• IoT, cyber-physical, embedded systems and applications
• Systems-on-a-chip, networks-on-a-chip and systems-in-a-package
• High-performance, energy-efficient multi-core and many-core (heterogeneous) processor architectures.
• Autonomous/adaptable/reconfigurable systems and architectures
• Security, safety, reliability and multi-objective optimization of embedded and cyber-physical systems
• Future trends, new applications and new technologies

Special sessions

• AHSA: Architectures and Hardware for Security Applications, P. Kitsos (University of Peloponnese, GR), M. Novotny (CTU Prague, CZ)
• ASHWPA: Advanced Systems for Health Wellness and Personal Monitoring, F. Leporati (U Pavia, IT), R. Stojanovic (U Montenegro, ME), E. Marenzi (U Pavia, IT)
• DDVC: Digital Design and Verification with Chisel, M. Schoeberl (DTU, DK)
• DTFT: Dependability, Testing and Fault Tolerance in Digital Systems, P. Fiser (CTU Prague, CZ), H. Kubátová (CTU in Prague, CZ)
• EMPDSD: European and Major Multi-Partner Projects in Digital Systems Design, L. Jozwiak (TU/e, NL), F. Leporati (U Pavia, IT), E. Torti (U Pavia, IT)
• HIAAA: Hyperspectral Imaging Applications, Algorithms and Architectures, G. M. Callico (IUMA/ULPGC, ES), H. Fabelo (FIISC/IUMA/ULPGC, ES), S. Ortega (NOFIMA, NO)
• HSTIEC: Hardware, Software, and Tools for the IoT-to-Edge-to-Cloud Continuum, F. Aromolo (Scuola Superiore Sant’Anna, IT), D. Casini (Scuola Superiore Sant’Anna, IT), G. Rossolini (Scuola Superiore Sant’Anna, IT)
• MATTERV : Opensource Methods, architectures, tools and technologies for RISC-V, S. Pillement (U. Nantes, FR), K. Martin (U. Bretagne-Sud, FR)
• SDSD: Sustainable Digital System Design, T. Marty (Insa, Rennes, FR), T. Scheipel (Graz University of Technology, AT), M. Baunach (Graz University of Technology, AT)
• SPCPS: Safety, Security and Privacy of Cyber-Physical Systems, S. Dey (IIT Kharagpur, India), S. Park (TU Berlin, D), J. Sepúlveda (Airbus Defence and Space GmbH, D)

Important dates

• Deadline for full paper submission:  15th April 2025
• Notification of acceptance: 15th May 2025
• Camera ready papers: 15th June 2025

Submission Guidelines

• Authors are required to submit their manuscripts via the EasyChair web service at the web page https://easychair.org/conferences/?conf=dsd2025. Should an unexpected web access problem be encountered, please contact the Program Chairs Daniel Casini and Francisco J. Cazorla.
• Each manuscript should include the complete paper text, all illustrations, and references. The manuscript should conform to the IEEE format: single-spaced, double-column, US letter page size, 10-point size Times Roman font, up to 8 pages. In order to conduct a double-blind review, no indication of the authors’ names should appear in the manuscript, references included. However, but authors should not hide previous work, instead, they need to make self-references in the third person.
• All papers will be reviewed according to common guidelines, quality requirements, and acceptance thresholds. Program Chairs reserve the possibility to transfer papers between the main track and the special sessions so that each paper is reviewed in the track in which it fits best.
• Accepted papers will be submitted for inclusion into IEEE Xplore Digital library and indexing services.
• Extended versions of selected best papers will be published in a special issue of the ISI indexed Euromicro/Elsevier journal “Microprocessors and Microsystems: Embedded Hardware Design” (MICPRO) having the 2022 Impact Factor as high as 2.6  and Cite Score 4.9.

Committees

Venue

Sorbonne University, Paris, France.

Contact

All questions about submissions should be emailed to Daniel Casini (daniel.casini@santannapisa.it) and Francisco J. Cazorla (francisco.cazorla@bsc.es).