The International Conference on Recent Advancements in Computing in AI, IoT and Computer Engineering Technology (CICET) is a communication platform of researchers and practitioners both from academia and . The main target of CICET 2020 is to bring together software/hardware engineering researchers, computer scientists, practitioners and people from industry and business to exchange theories, ideas, techniques and experiences related to all aspects of CICET. Finally, CICET 2020 will take place at The Tamkang University, Taipei, Taiwan, on 26th – 28th October 2020.

Recent progress in Deep Learning has unleashed some of the promises of Artificial Intelligence (AI), moving it from the realm of toy applications to a powerful tool that can be leveraged across a wide number of industries. In recognition of this, CICET has selected Artificial Intelligence and Machine Learning as this year’s central theme. We invite submissions across a wide range of topics in this area, including traditional machine learning and AI, deep learning, computer vision, robotics, and applications of these algorithms in any areas, as well as papers in other selected areas.

Submission Guidelines

Paper Submissions, Proceedings, Indexing and Journal Publications

All submitted papers should be in the form of .pdf and are to be limited to a maximum length of 6 pages (A4 size, single space, Times Roman of font size 10, two columns format), including figures, tables and references. There is no template for the initial paper. Please submit full papers using the EasyChair CICET 2020 webpage at 

If the paper(s) is/are accepted for publication, at least one of the authors of the accepted paper(s) must register to the CICET 2020.

Please note that the accepted papers in CICET 2020 will be published as a special issue of the International Journal IJDATICS (ISSN: 2223523X).

Papers presented at CICET 2020 will then be recommended to be extended for a range of Special Issues (SIs) for a number of international journals which are indexed by SCI-E, ESCI, Scopus, and/or EI, subject to the standards and quality requirements of that SI, listed as follows for your reference:

• Journal of Cognitive Science (Scopus & ESCI)
• Symmetry (SCI-E)
• Journal of Human-centric Computing and Information Sciences (SCI-E & Scopus)
• Journal of Communication Networks and Information Security (Scopus)
• Journal of Information Processing Systems  (ESCI)
• Journal of Sensors (SCI-E)
• Applied Sciences (SCI-E)
• Journal of Internet Technology (SCI-E)
• Journal of Universal Computer Science (SCI-E)

Committees

Honorary Chairs

• Jian-Nong Cao, Hong Kong Polytechnic University, Hong Kong
• Han-Chieh Chao, National Dong Hwa University, Taiwan

Advisory Board

• Hui-Huang Hsu, Tamkang University, Taiwan
• Paolo Prinetto, Politecnico di Torino, Italy
• Massimo Poncino, Politecnico di Torino, Italy
• Joongho Choi, University of Seoul, South Korea
• Michel Schellekens, University College Cork, Ireland
• M L Dennis Wong, Heriot-Watt University, Scotland
• Vladimir Hahanov, Kharkov National University of Radio Electronics, Ukraine
• Chun-Cheng Lin, National Chiao Tung University, Taiwan

General Chairs

• Ka Lok Man, Xi’an Jiaotong-Liverpool University, China; Swinburne University of Technology Sarawak, Malaysia; and imec-DistriNet, KU Leuven, Belgium
• Woon Kian Chong, SP Jain School of Global Management, Singapore
• Owen Liu, Aston University, UK

Local Chair

• Chien-Chang Chen, Tamkang University, Taiwan

Industrial Liaison Chair

• Gangming Li, Xi’an Jiaotong-Liverpool University, China

Publicity Chairs

• Vincent Ng, The Hong Kong Polytechnic University, Hong Kong
• Neil Y.(Yuwen) Yen, The University of AIZU, Japan
• Patrick HangHui Then, Swinburne University of Technology Sarawak, Malaysia

Program/Workshop Chairs

• Tomas Krilavičius, Baltic Institute of Advanced Technologies and Vytautas Magnus University, Lithuania
• Seungmin Rho, Sungkyul University, South Korea
• Sheung-Hung Poon, University of Technology Brunei, Brunei Darussalam
• Chuck Fleming, Xi’an Jiaotong-Liverpool University, China
• Yujia Zhai, Xi’an Jiaotong-Liverpool University, China

Program Committee

• Alberto Macii, Politecnico di Torino, Italy
• Wei Li, Fudan University, China
• Emanuel Popovici, University College Cork, Ireland
• Jong-Kug Seon, System LSI Lab., LS Industrial Systems R&D Center, South Korea
• Umberto Rossi, STMicroelectronics, Italy
• Franco Fummi, University of Verona, Italy
• Graziano Pravadelli, University of Verona, Italy
• Yui Fai Lam, Hong Kong University of Science and Technology, Hong Kong
• Jinfeng Huang, Philips &LiteOn Digital Solutions Netherlands, The Netherlands
• Jun-Dong Cho, Sung Kyun Kwan University, South Korea
• Gregory Provan, University College Cork, Ireland
• Miroslav N. Velev, Aries Design Automation, USA
• M. Nasir Uddin, Lakehead University, Canada
• Dragan Bosnacki, Eindhoven University of Technology, The Netherlands
• Milan Pastrnak, Siemens IT Solutions and Services, Slovakia
• John Herbert, University College Cork, Ireland
• Zhe-Ming Lu, Sun Yat-Sen University, China
• Jeng-Shyang Pan, National Kaohsiung University of Applied Sciences, Taiwan
• Chin-Chen Chang, Feng Chia University, Taiwan
• Mong-Fong Horng, Shu-Te University, Taiwan
• Liang Chen, University of Northern British Columbia, Canada
• Chee-Peng Lim, University of Science Malaysia, Malaysia
• Salah Merniz, Mentouri University, Constantine, Algeria
• Oscar Valero, University of Balearic Islands, Spain
• Yang Yi, Sun Yat-Sen University, China
• Damien Woods, University of Seville, Spain
• Franck Vedrine, CEA LIST, France
• Bruno Monsuez, ENSTA, France
• Kang Yen, Florida International University, USA
• Takenobu Matsuura, Tokai University, Japan
• R. Timothy Edwards, MultiGiG, Inc., USA
• Olga Tveretina, Karlsruhe University, Germany
• Maria Helena Fino, Universidade Nova De Lisboa, Portugal
• Adrian Patrick ORiordan, University College Cork, Ireland
• Grzegorz Labiak, University of Zielona Gora, Poland
• Jian Chang, Texas Instruments, Inc, USA
• Yeh-Ching Chung, National Tsing-Hua University, Taiwan
• Anna Derezinska, Warsaw University of Technology, Poland
• Kyoung-Rok Cho, Chungbuk National University, South Korea
• Yuanyuan Zeng, Wuhan university, China
• D.P. Vasudevan, University College Cork, Ireland
• Arkadiusz Bukowiec, University of Zielona Gora, Poland
• Maziar Goudarzi, Sharif University of Technology, Iran
• Jin Song Dong, National University of Singapore, Singapore
• Dhamin Al-Khalili, Royal Military College of Canada, Canada
• Zainalabedin Navabi, University of Tehran, Iran
• Lyudmila Zinchenko, Bauman Moscow State Technical University, Russia
• Muhammad Almas Anjum, National University of Sciences and Technology (NUST), Pakistan
• Deepak Laxmi Narasimha, University of Malaya, Malaysia
• Danny Hughes, Katholieke Universiteit Leuven, Belgium
• Jun Wang, Fujitsu Laboratories of America, Inc., USA
• A.P. Sathish Kumar, PSG Institute of Advanced Studies, India
• N. Jaisankar, VIT University. India
• Atif Mansoor, National University of Sciences and Technology (NUST), Pakistan
• Steven Hollands, Synopsys, Ireland
• Siamak Mohammadi, University of Tehran, Iran
• Felipe Klein, State University of Campinas (UNICAMP), Brazil
• Eng Gee Lim, Xi’an Jiaotong-Liverpool University, China
• Kevin Lee, Deakin University, Australia
• Prabhat Mahanti, University of New Brunswick, Saint John, Canada
• Kaiyu Wan, Xi’an Jiaotong-Liverpool University, China
• Tammam Tillo, Xi’an Jiaotong-Liverpool University, China
• Yanyan Wu, Xi’an Jiaotong-Liverpool University, China
• Wen Chang Huang, Kun Shan University, Taiwan
• Masahiro Sasaki, The University of Tokyo, Japan
• Shishir K. Shandilya, NRI Institute of Information Science & Technology, India
• J.P.M. Voeten, Eindhoven University of Technology, The Netherlands
• Wichian Sittiprapaporn, Mahasarakham University, Thailand
• Aseem Gupta, Freescale Semiconductor Inc., Austin, TX, USA
• Kevin Marquet, Verimag Laboratory, France
• Matthieu Moy, Verimag Laboratory, France
• RamyIskander, LIP6 Laboratory, France
• Chung-Ho Chen, National Cheng-Kung University, Taiwan
• Kyung Ki Kim, Daegu University, Korea
• Shiho Kim, Chungbuk National University, Korea
• Hi Seok Kim, Cheongju University, Korea
• Brian Logan, University of Nottingham, UK
• AsokeNath, St. Xavier’s College (Autonomous), India
• Tharwon Arunuphaptrairong, Chulalongkorn University, Thailand
• Shin-Ya Takahasi, Fukuoka University, Japan
• Cheng C. Liu, University of Wisconsin at Stout, USA
• Farhan Siddiqui, Walden University, Minneapolis, USA
• Katsumi Wasaki, Shinshu University, Japan
• Pankaj Gupta, Microsoft Corporation, USA
• Masoud Daneshtalab, University of Turku, Finland
• Boguslaw Cyganek, AGH University of Science and Technology, Poland
• Yeo Kiat Seng, Nanyang Technological University, Singapore
• Tom English, Xlinx, Ireland
• Nicolas Vallee, RATP, France
• Rajeev Narayanan, Cadence Design Systems, Austin, TX, USA
• Xuan Guan, Freescale Semiconductor, Austin, TX, USA
• Pradip Kumar Sadhu, Indian School of Mines, India
• FeiQiao, Tsinghua University, China
• Chao Lu, Purdue University, USA
• Ding-Yuan Cheng, National Chiao Tung University, Taiwan
• Pradeep Sharma, IEC College of Engineering & Technology, Greater Noida, GB Nagar UP, India
• Ausra Vidugiriene, Vytautas Magnus University, Lithuania
• Lixin Cheng, Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), Chinese Academy of Sciences, China
• Yue Yang, Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), Chinese Academy of Sciences, China
• Yo-Sub Han, Yonsei University, South Korea
• Hwann-Tzong Chen, National Tsing Hua University, Taiwan
• Michele Mercaldi, EnvEve, Switzerland
• Valliapan Raman, Swinburne University of Technology Sarawak, Malaysia

Contact

All questions about submissions should be emailed to info@datics.org