BEC2018: Baltic Electronics Conference 2018 Tallinn, Estonia, October 8-10, 2018 |
Conference website | http://www.ttu.ee/bec |
Submission link | https://easychair.org/conferences/?conf=bec2018 |
Submission deadline | June 10, 2018 |
Updating submissions is possible till June 30 | June 18, 2018 |
FINAL VERSION DEADLINE AUGUST 20 | August 20, 2018 |
Submission Guidelines
Prospective authors are requested to submit a full paper of four (never three!) A4 pages including illustrations and references, in English, in the format of a PDF file.
NEW Dates !
Deadline for submission June 10, 2018 updating submissions is possible till June 18 and notification of acceptance will be given before July 30, 2018.
Deadline to submit the final version is August 20, 2018.
Deadline for payment of regular conference fee is August 20, 2018.
Accepted papers will be published as submitted in the Conference Proceedings (USB stick) that will be provided to all participants at the beginning of the Conference. To have the paper included in the final programme, proceedings and IEEE Xplore, the presenting author must register as a regular attendee (or as a degree student if applicable). As an IEEE policy, the papers by no-show authors will not be included in the IEEE Xplore.
Please use the Guidelines for preparation of the manuscript !
For further information concerning the scientific program and submitted contribution, please contact dr. A. Koel or prof. P. Ellervee.
Registration Guidelines
To register please go to: Registration webpage
List of Topics
- Cognitive Systems and Communication
Wireless communication and system (4G, 5G and beyond), RF and Optical aspects, Internet of things (LoRa, Sigfox, NB-IoT etc.), wearable sensor networks (on-body, off-body and body-to-body), Low-power platforms for communication, Cognitive networking. - Cyberphysical Systems
Heterogeneous components and design integration. Cognitive robotics. Critical infrastructures. Heterogeneous multi-agent systems. Smart sensing, monitoring, modelling and processing of biomedical data and objects. - Digital and Embedded Systems
Simulation and synthesis methods and tools. Logic, behavioral and system level design. Embedded systems design, integration and validation. Multi- and many-core systems. Embedded and real-time hardware/software systems. Low power systems. - Instrumentation, Signal Processing and RF Solutions
Data acquisition, sensors, signal and data processing, NDT, SHM and CM applications, system identification, image processing, multimedia; navigation and positioning, radar, sonar; instrumentation and measurement devices and systems, hardware-, software- and integration aspects. - Power Electronics
Theoretical and practical aspects of implementation of power converters in industry and transportation, modeling, simulation and control of power electronics, distributed power generation, integrated renewable systems, smart grids, hybrid- and full-electric vehicles. - Semiconductor Devices and Integrated Circuit Design
Wide-band-gap solutions, solar cell and photonics, thermoelectricity. Nano-, micro-, opto-, and thermoelectric, devices: characterisation, modelling and simulation. Analog, digital and mixed IC design. Sensor- and low power solutions. Energy harvesting. Lab-on-Chip. - Test, Verification and Dependability
Defect modeling, test generation, fault simulation, fault diagnosis, built-in self-test, desing-for-testability, verification and validation, fault tolerance, dependability, quality of service, reliability, survivability, availability, safety and security.
Committees
Steering Committee Members (Tallinn University of Technology)
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Ants Koel
chairmanSemiconductor Devices and Integrated Circuit Design Thomas Johann Seebeck Department of Electronics Toomas Rang
honour chairmanSemiconductor Devices and Integrated Circuit Design Thomas Johann Seebeck Department of Electronics Peeter Ellervee
vice-chairmanDigital and Embedded Systems Department of Computer Systems Alar Kuusik Digital and Embedded Systems Thomas Johann Seebeck Department of Electronics Muhammad Mahtab Alam Cognitive Systems and Communication Thomas Johann Seebeck Department of Electronics Yannick Le Moullec Cognitive Systems and Communication Thomas Johann Seebeck Department of Electronics Jüri Vain Cyberphysical Systems Department of Software Science Kristjan Pilt Cyberphysical Systems Department of Health Technologies Olev Märtens Instrumentation, Signal Processing and RF Solutions Thomas Johann Seebeck Department of Electronics Paul Annus Instrumentation, Signal Processing and RF Solutions Thomas Johann Seebeck Department of Electronics Dmitri Vinnikov Power Electronics Department of Electrical Power Engineering and Mechatronics Indrek Roasto Power Electronics Department of Electrical Power Engineering and Mechatronics Jaan Raik Test, Verification and Dependability Department of Computer Systems Leonidas Tsiopoulos Test, Verification and Dependability Department of Computer Systems
Invited Speakers
- Prof. Marta Rencz, Budapest University of Technology and Economics (Hungary)
LED modelling for Industry 4.0 in the Delphi4LED project.
The Industry 4.0 initiative targets the digitization of design and manufacturing processes. The aim of the Delphi4LED H2020 ECSEL R&D project of the EU (www.delphi4LED.org) is to trigger this transition in the solid-state lighting industry by developing testing and modelling methodologies aimed at multi-domain characterization of LED based products. In this paper the concept and our approaches will be presented in modelling to create the appropriate “digital twins” of LED packages, modules and luminaries to be used in virtual prototypes applied in different system level design tasks.
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Dr. Daniel Foty, Gilgamesh Associates, LLC (USA)
Amplification, Feedback, and Sub-Biasing: Applying Analog Techniques to High-Speed, Low-Power Digital CMOS Circuits at Dimensions Below 100nm
Analog and digital circuit design architectures are usually regarded as separate spheres – with very different objectives, and consequently with different methods of approaching the design challenges.Some twenty-five years ago, several remarkable United States patents were issued to the late Albert Vinal; these patents were developed and issued at a time when it had not even become clear yet that CMOS was actually viable as (among other things) a high-speed digital circuit technology. What makes these patents remarkable is not only that they reflect a clear understanding that CMOS was indeed on the verge of being a high-speed technology - they also employ a number of analog-looking techniques (such as serial-amplification and feedback) as the bases for their architectures.
This presentation will revisit four of the aforementioned patents, particularly with regard to the CMOS technology of the period. The behavior of these architectures will then be evaluated in the context of the evolution of CMOS technology into the present day – with respect to lower power supply voltages, low-power operation, and circuit operation in the moderate and weak inversion regimes. This presentation will extend the 2016 Baltic Electronics Conference presentation – to CMOS processes with feature sizes smaller than 100nm
- Prof. Francois Verdier, Universite de Nice (France)
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Prof. Ørjan Grøttem Martinsen, University of Oslo (Norway)
“From linear to memristive electrical properties of human skin”
The linear electrical properties (bioimpedance) of human skin have been studied for many decades because of its importance in applications such as electrodermal response measurements and measurements of endogenous potentials (e.g. electrocardiography). During the last decade, however, there has been an increased focus on the non-linear electrical properties of skin and other biomaterials. Studies have shown that human skin behaves like a memristor and even that information can be stored in the skin. In this presentation, I will go through different applications of linear electrical properties of the skin and then move on to recent findings of memristive properties and some speculations of possible applications for these kind of measurements.
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Prof. Serge Dos Santos, INSA Centre Val de Loire (France)
Systemic multimodal technologies for entering in the NDT 4.0 transition: signal, image, and data for monitoring the health of biological, medical and industrial complex processes.
In this keynote, an overview of the ninety years of nondestructive testing (NDT) progresses will be presented in connection with the progress also done in the domain of ultrasonic medical imaging developing multimodalities. The importance of signal, image, data will be presented as a basic ingredient for entering in the transition of Industry 4.0 for NDT. As an evidence, all aspects within Industry 4.0 are needed for the inspection of materials from row to machined, inspected, and classified until delivering to the customer and during its operational time. Like biological systems, the material might be equipped with sensors from the beginning of its life, which keep its structural integrity though all information about its aging and choosing the optimized way for its expected long life. The concept of NDT 4.0 will be discussed within the scope of future smart technologies and services.
Publication
The conference is approved by IEEE under registration #44413, and the full texts of the accepted and presented papers will be submitted to IEEE Xplore®
NEW Information (21.05.2018)
The technical committee will propose the authors of selected papers to have their work extendended for publication in Special editions in one of the following journals:
Sensors (ISSN 1424-8220; CODEN: SENSC9); open access; Impact Factor: 2.677 (2016)
The Proceedings of the Estonian Academy of Sciences ISSN 1736-7530 (electronic) ISSN 1736-6046 (print) ; open access; RG Impact Factor 0.89 (2015)
The extended papers (min 50% of original) will pass the journal’s review process, independent from the BEC review process, and will be subject to additional payment – according to the publisher’s policy.
Publication in MDPI Sensors Special issue – 1620CHF
Publication in the Proceedings of the Estonian Academy of Sciences Special issue – 500€
Venue
The Conference opening plenary session will be taken place at Tallinn University of Technology Mectory house located about 8 km to the south from the Centre, and afterwords the Conference site will be Hestia Laulasmaa SPA, located about 30 km from the Centre
The conference place (first day, Oct.8) Tallinn University of Technology Mektory house, Address: Raja 15, 12618 Tallinn, Location plan
The conference place (Oct.4 and 5) will be Hestia Hotel Laulasmaa SPA, Address: Puhkekodu 4, Laulasmaa 76702, Keila parish, Estonia, Location plan
Contact
All questions about submissions should be emailed to bec@ttu.ee
Sponsors
Technically co-sponsored by
IEEE Estonia Section