2022 IEEE INTERCON: 2022 IEEE XXIX International Conference on Electronics, Electrical Engineering and Computing Universidad Nacional Mayor de San Marcos Lima, Peru, August 11-13, 2022 |
Conference website | http://www.intercon.org.pe |
Submission link | https://easychair.org/conferences/?conf=2022ieeeintercon |
Poster | download |
Submission Extended deadline | May 30, 2022 |
Submission deadline | May 30, 2022 |
The 2022 IEEE XXIX International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity.
CFP INTERCON 2022 has been redesigned in a virtual environment, for the safety of our community and to offer an inclusive experience.
For oral presentations, will use teleconferences tools to prepare interactive presentation sessions. Remote hosts will use a common remote presence software tool which will be determined and announced by the organizing committee.
Submission Guidelines
- The official language of 2022 IEEE INTERCON is ENGLISH. The maximum number of authors per paper, including co-authors is four (4). Papers must be submmited in PDF and no longer than four (4) pages, following the IEEE Conference Template available at: https://www.ieee.org/conferences/publishing/templates.html
- We will use EasyChair system for submissions here: https://easychair.org/conferences/?conf=2022ieeeintercon
- Accepted technical papers will be submitted to the IEEE Xplore Digital Library.
List of Topics
- Communication systems
- Semiconductor and devices
- Computers and information technology
- Signal processing
- Systems and control
- Emerging technologies
- Circuits and systems
- Power generation, transmission and distribution
- Renewable energy sources, smartgrids technologies
- Optoelectronic materials, devices and systems
- Climatic change & Renewable energy
- DC systems in High Voltage, BESS and nuclear power plants.
- Bioengineering
- Power electronics, systems and applications
- Electrical machines and adjustable speed drives
- High voltage engineering and insulation technology
- Algorithms and complexity
- Architecture and organization
- Graphics and visualization
- Information management, assurance and security
- Intelligent systems
- Parallel and distributed Computing
- Software engineering
- Social issues and professional practice
- Research & Development restrictions and improvements
Committees
Organizing Committee Conference Chair: | Jorge Lafitte | dr.jorge.lafitte@ieee.org |
Technical Program Chair: | Ricardo Arias | ricardo.ariasvelasquez.eng@ieee.org |
Publication Chair: | José Durán | joseduran@ieee.org |
Publication Co Chair: | Marco Cruz | marcocruz@ieee.org |
Conference Treasurer: | Romel Jimenez | rjimenez@ieee.org |
Information Contact: | Nicole Caballero | nicole.caballero@ieee.org |
Dario Utrilla | dutrillas@unmsm.edu.pe | |
Fiorella Montalvo | fiorella_montalvo@ieee.org |
New author registration fees
The author registration fees has been modified according to the following table.
Author Registration Type | Registration Fees in US Dollars |
IEEE undergraduate student andIEEE graduate student member (*) | 200.00 |
IEEE members in general | 260.00 |
Non IEEE | 330.00 |
(*) Accredited by an educational institution official current enrollment report.
All the author registered will have access to participate at the whole conferences virtual events including keynote conferences and authors oral presentation.
Sponsored
Technical and Financial Sponsored By: | IEEE Perú Section |
Technical Sponsored By: | Universidad Nacional Mayor de San Marcos, IEEE Student Branch |